opa177

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1990 Burr-Brown Corporation PDS-1081E Printed in U.S.A. August, 1997

OPA177

FEATURESq LOW OFFSET VOLTAGE: 25 V maxq

LOW DRIFT: 0.3 V/Cq HIGH OPEN-LOOP GAIN: 130dB minq LOW QUIESCENT CURRENT: 1.5mA typq REPLACES INDUSTRY-STANDARD OP

AMPS: OP-07, OP-77, OP-177, AD707,ETC.

APPLICATIONSq PRECISION INSTRUMENTATIONq

DATA ACQUISITIONq TEST EQUIPMENTq BRIDGE AMPLIFIERq THERMOCOUPLE AMPLIFIER

PrecisionOPERATIONAL AMPLIFIER

14k

500

Trim8

V+7

Trim1

+In3

In2

V 4

25

30

V6

O

20A

500

DESCRIPTIONThe OPA177 precision bipolar op amp feature verylow offset voltage and drift. Laser-trimmed offset,drift and input bias current virtually eliminate the needfor costly external trimming. The high performanceand low cost make them ideally suited to a wide rangeof precision instrumentation.

The low quiescent current of the OPA177 dramati-cally reduce warm-up drift and errors due to thermo-

electric effects in input interconnections. It providesan effective alternative to chopper-stabilized amplifi-ers. The low noise of the OPA177 maintains accuracy.

OPA177 performance gradeouts are available. Pack-aging options include 8-pin plastic DIPand SO-8 surface-mount packages.

International Airport Industrial Park Mailing Address: PO Box 11400, Tucson, AZ 85734 Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 Tel: (520) 746-1111 Twx: 910-952-11Internet: http://www.burr-brown.com/ FAX Line: (800) 548-6133 (US/Canada Only) C able: BBRCORP Telex: 066-6491 FAX: (520) 889-1510 Imme diate Product Info: (800) 548-6

O P A 1 7 7

O P A 1 7 7

SBOS008

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OPA177

OPA177 SPECIFICATIONSAt VS = 15V, T A = +25 C, unless otherwise noted.

OPA177F OPA177G

PARAMETER CONDITION MIN TYP MAX MIN TYP MAX UNITS

OFFSET VOLTAGEInput Offset Voltage 10 25 20 60 VLong-Term Input Offset (1) 0.3 0.4 V/MoVoltage Stability

Offset Adjustment Range R P = 20k 3 T mVPower Supply Rejection Ratio V S = 3V to 18V 115 125 110 120 dB

INPUT BIAS CURRENTInput Offset Current 0.3 1.5 T 2.8 nAInput Bias Current 0.5 2 T 2.8 nA

NOISEInput Noise Voltage 1Hz to 100Hz (2) 85 150 T T nVrmsInput Noise Current 1Hz to 100Hz 4.5 T pArms

INPUT IMPEDANCEInput Resistance Differential Mode (3) 26 45 18.5 T M

Common-Mode 200 T G

INPUT VOLTAGE RANGECommon-Mode Input Range (4) 13 14 T T VCommon-Mode Rejection V CM = 13V 130 140 115 T dB

OPEN-LOOP GAIN RL 2k

Large Signal Voltage Gain V O = 10V(5)

5110 12,000 2000 6000 V/mVOUTPUTOutput Voltage Swing R L 10k 13.5 14 T T V

RL 2k 12.5 13 T T VRL 1k 12 12.5 T T V

Open-Loop Output Resistance 60 T

FREQUENCY RESPONSESlew Rate R L 2k 0.1 0.3 T T V/ sClosed-Loop Bandwidth G = +1 0.4 0.6 T T MHz

POWER SUPPLYPower Consumption V S = 15V, No Load 40 60 T T mW

VS = 3V, No Load 3.5 4.5 T T mWSupply Current V S = 15V, No Load 1.3 2 T T mA

At VS = 15V, 40 C TA +85 C, unless otherwise noted.

OFFSET VOLTAGEInput Offset Voltage 15 40 20 100 VAverage Input Offset 0.1 0.3 0.7 1.2 V/ C

Voltage DriftPower Supply Rejection Ratio V S = 3V to 18V 110 120 106 115 dB

INPUT BIAS CURRENTInput Offset Current 0.5 2.2 T 4.5 nAAverage Input Offset Current 1.5 40 T 85 pA/ C

Drift(6)Input Bias Current 0.5 4 T 6 nAAverage Input Bias Current 8 40 15 60 pA/ C

Drift(6)

INPUT VOLTAGE RANGECommon-Mode Input Range 13 13.5 T T VCommon-Mode Rejection V CM = 13V 120 140 110 T dB

OPEN-LOOP GAINLarge Signal Voltage Gain R L 2k, V O = 10V 2000 6000 1000 4000 V/mV

OUTPUTOutput Voltage Swing R L 2k 12 13 T T V

POWER SUPPLYPower Consumption V S = 15V, No Load 60 75 T T mWSupply Current V S = 15V, No Load 2 25 T T mA

T Same as specification for product to left.

NOTES: (1) Long-Term Input Offset Voltage Stability refers to the averaged trend line of V OS vs time over extended periods after the first 30 days of operation. Excludingthe initial hour of operation, changes in V OS during the first 30 operating days are typically less than 2 V. (2) Sample tested. (3) Guaranteed by design. (4) Guaranteedby CMRR test condition. (5) To insure high open-loop gain throughout the 10V output range, A OL is tested at 10V VO 0V, 0V VO +10V, and 10V VO +10V.(6) Guaranteed by end-point limits.

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OPA177

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumesno responsibility for the use of this information, and all use of such information shall be entirely at the users own risk. Prices and specifications are subject to changewithout notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrantany BURR-BROWN product for use in life support devices and/or systems.

PIN CONFIGURATION

Top View DIP/SOIC

ABSOLUTE MAXIMUM RATINGS

ELECTROSTATICDISCHARGE SENSITIVITY

Any integrated circuit can be damaged by ESD. Burr-Brownrecommends that all integrated circuits be handled withappropriate precautions. ESD can cause damage rangingfrom subtle performance degradation to complete devicefailure. Precision integrated circuits may be more suscep-tible to damage because very small parametric changescould cause the device not to meet published specifications.

Burr-Browns standard ESD test method consists of five1000V positive and negative discharges (100pF in serieswith 1.5k ) applied to each pin.

Failure to observe proper handling procedures could resultin small changes to the OPA177s input bias current.

1

2

3

4

8

7

6

5

Offset Trim

In

+In

V

Offset Trim

V+

V

No Internal Connection

O

Power Supply Voltage ....................................................................... 22VDifferential Input Voltage ................................................................... 30VInput Voltage ....................................................................................... VSOutput Short Circuit ................................................................. ContinuousOperating Temperature:

Plastic DIP (P), SO-8 (S) .............................................. 40 C to +85 C JA (PDIP) ................................................................................. 100 C/W JA (SOIC)................................................................................. 160 C/W

Storage Temperature:

Plastic DIP (P), SO-8 (S) ............................................ 65 C to +125 CJunction Temperature .................................................................... +150 CLead Temperature (soldering, 10s) P packages ........................... +300 C

(soldering, 3s) S package............................... +260 C

PACKAGEDRAWING TEMPERATURE

PRODUCT PACKAGE NUMBER (1) RANGE

OPA177FP 8-Pin Plastic DIP 006 40 C to +85 COPA177GP 8-Pin Plastic DIP 006 40 C to +85 COPA177GS SO-8 Surface-Mount 182 40 C to +85 C

NOTE: (1) For detailed drawing and dimension table, please see end of datasheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION

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OPA177

TYPICAL PERFORMANCE CURVESAt TA = +25 C, VS = 15V, unless otherwise noted.

10 30 50 700 20 40 60

30

25

20

15

10

5

0

A b s o l u t e

C h a n g e

i n I n p u

t

O f f s e t

V o

l t a g e

( V )

Time (s)

OFFSET VOLTAGE CHANGEDUE TO THERMAL SHOCK

80

Device Immersed in 70C Inert Liquid

Plastic DIP

CLOSED-LOOP RESPONSE vs FREQUENCY100

80

60

40

20

0

2010 100 1k 10k 100k 1M 10M

C l o s e

d - L o o p

G a i n

( d B )

Frequency (Hz)

3

2

1

0

1

2

3

O f f s e

t V o

l t a g e

C h a n g e

( V )

0 30 60 90 120

Time from Power Supply Turn-On (s)

WARM-UP OFFSET VOLTAGE DRIFT

15 45 75 105

17.5

15

12.5

10

7.5

5

2.5

0

V O U T

( V )

0 6 12 18 24 30 36

IOUT (mA)

MAXIMUM VOUT vs IOUT(Positive Swing)

VS = 18V

VS = 15V

VS = 12V

VS = 15V

17.5

15

12.5

10

7.5

5

2.5

0

V O U T

( V )

0 2 4 6 8 10 12

IOUT (mA)

MAXIMUM VOUT vs I OUT(Negative Swing)

VS = 18V

VS = 15V

VS = 12V

VS = 15V

1

0.1

0.01

0.001

T H D +

N ( % )

1k 10k 100k

Frequency (Hz)

TOTAL HARMONIC DISTORTION AND NOISEvs FREQUENCY

A = 20dB, 3Vrms, 10k load

30kHz low pass filtered

InvertingNoninverting

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TYPICAL PERFORMANCE CURVES (CONT)At TA = +25 C, VS = 15V, unless otherwise noted.

150

140

130

120

110

100

90

80

C M R R ( d B )

1 10 100 1k 10k 100k

Frequency (Hz)

CMRR vs FREQUENCYOPEN-LOOP GAIN/PHASE vs FREQUENCY160

140

120

100

80

60

40

20

0

O p e n -

L o o p

G a i n

( d B )

0.01 1 10 100 1k 10k 100k 1M0.1

Frequency (Hz)

0

45

90

135

180

P h a s e

S h i f t ( D e g r e e s

)

Phase

Gain

2

1

0

1

2 40 15 10 35 60 85

Temperature (C)

INPUT BIAS AND INPUT OFFSET CURRENTvs TEMPERATURE

I n p u

t B i a s a n

d I n p u

t O f f s e

t C u r r e n t

( n A )

IB

IOS

150

130

110

90

70

50

P o w e r

S u p p

l y R e j e c

t i o n

( d B )

1 10 100 1k 10k0.1

Frequency (Hz)

POWER SUPPLY REJECTIONvs FREQUENCY

1k

100

10

1

I n p u

t N o

i s e

V o

l t a g e

( n V / H z

)

1

Frequency (Hz)

INPUT NOISE VOLTAGE DENSITY vs FREQUENCY

10 100 1k 10k

R = 0S

R = R = 200kThermal noise ofsource resistorsincluded.

S1 S2 10

1

0.1

0.01

R M S

N o i s e

( V )

100 1k 10k 100k

Bandwidth (Hz)

TOTAL NOISE vs BANDWIDTH(0.1Hz to Frequency Indicated)

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TYPICAL PERFORMANCE CURVES (CONT)At TA = +25 C, VS = 15V, unless otherwise noted.

40

35

30

25

20

15

O u t p u

t S h o r t - C

i r c u i

t C u r r e n

t ( m

A )

0 1 2 3 4

Time from Output Being Shorted (min)

OUTPUT SHORT-CIRCUIT CURRENT vs TIME

SC

I SC

I +

20

15

10

5

0

M a x

i m u m

O u t p u

t ( V )

100 10k

Load Resistance to Ground ( )

MAXIMUM OUTPUT VOLTAGE vs LOAD RESISTANCE

1k

NegativeOutput

PositiveOutput

32

28

24

20

16

12

8

4

0

P e a

k - t o - P e a

k A m p l

i t u d e ( V )

1k 10k 100k 1M

Frequency (Hz)

MAXIMUM OUTPUT SWING vs FREQUENCY

G = +1R = 2kL

100

10

1

P o w e r

C o n s u m p t

i o n

( m W )

0 10 20 30 40

Total Supply Voltage (V)

POWER CONSUMPTION vs POWER SUPPLY

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OPA177

APPLICATIONS INFORMATIONThe OPA177 is unity-gain stable, making it easy to use andfree from oscillations in the widest range of circuitry. Ap-plications with noisy or high impedance power supply linesmay require decoupling capacitors close to the device pins.In most cases 0.1 F ceramic capacitors are adequate.

The OPA177 has very low offset voltage and drift. To

achieve highest performance, circuit layout and mechanicalconditions must be optimized. Offset voltage and drift canbe degraded by small thermoelectric potentials at the op ampinputs. Connections of dissimilar metals will generate ther-mal potential which can mask the ultimate performance of the OPA177. These thermal potentials can be made to cancelby assuring that they are equal in both input terminals.

1. Keep connections made to the two input terminals closetogether.

2. Locate heat sources as far as possible from the criticalinput circuitry.

3. Shield the op amp and input circuitry from air currentssuch as cooling fans.

OFFSET VOLTAGE ADJUSTMENTThe OPA177 has been laser-trimmed for low offset voltageand drift so most circuits will not require external adjust-ment. Figure 1 shows the optional connection of an externalpotentiometer to adjust offset voltage. This adjustment shouldnot be used to compensate for offsets created elsewhere in asystem since this can introduce excessive temperature drift.

INPUT PROTECTIONThe inputs of the OPA177 are protected with 500 seriesinput resistors and diode clamps as shown in the simplifiedcircuit diagram. The inputs can withstand 30V differentialinputs without damage. The protection diodes will, of course,conduct current when the inputs are overdriven. This maydisturb the slewing behavior of unity-gain follower applica-tions, but will not damage the op amp.

NOISE PERFORMANCEThe noise performance of the OPA177 is optimized forcircuit impedances in the range of 2k to 50k . Total noisein an application is a combination of the op amps inputvoltage noise and input bias current noise reacting withcircuit impedances. For applications with higher source

impedance, the OPA627 FET-input op amp will generallyprovide lower noise. For very low impedance applications,the OPA27 will provide lower noise.

INPUT BIAS CURRENT CANCELLATIONThe input stage base current of the OPA177 is internallycompensated with an equal and opposite cancellation cur-rent. The resulting input bias current is the differencebetween the input stage base current and the cancellationcurrent. This residual input bias current can be positive ornegative.

When the bias current is cancelled in this manner, the inputbias current and input offset current are approximately the

same magnitude. As a result, it is not necessary to balancethe DC resistance seen at the two input terminals (Figure 2).A resistor added to balance the input resistances may actu-ally increase offset and noise.

FIGURE 1. Optional Offset Nulling Circuit.

OPA177 V

2

3

1

8

Trim Range is approximately 3.0mV

V+

20k

OUTVIN

Op Amp

(a)

RB

OPA177

(b)

No bias currentcancellation resistor needed

Conventional op amp withexternal bias currentcancellation resistor.

OPA177 with no externalbias current cancellationresistor.

= R2 || R 1

R2

R1

R2

R1

FIGURE 2. Input Bias Current Cancellation.

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PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

OPA177FP ACTIVE PDIP P 8 50 Green (RoHS &no Sb/Br)

CU NIPDAU N / A for Pkg Type

OPA177FPG4 ACTIVE PDIP P 8 50 Green (RoHS &no Sb/Br)


OPA177GP ACTIVE PDIP P 8 50 Green (RoHS &no Sb/Br)


OPA177GPG4 ACTIVE PDIP P 8 50 Green (RoHS &no Sb/Br)


OPA177GS ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

OPA177GS/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &no Sb/Br)


OPA177GS/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &no Sb/Br)


OPA177GS/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &no Sb/Br)


OPA177GSE4 ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)


OPA177GSG4 ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)


(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Feb-2009

Addendum-Page 1
http://www.ti.com/productcontenthttp://www.ti.com/productcontent

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1(mm)

W(mm) Q

OPA177GS/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 1

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA177GS/2K5 SOIC D 8 2500 346.0 346.0 29.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 2

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I M P O R T A N T N O T I C E

T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e ao b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y ts o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c

T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c aw a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t Tm a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d

T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .

T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o ro r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f op u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e cp r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .

R e p r o d u c t i o n o f T I i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p ab y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c eb u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n . I n f o r m a t i o n o f t hr d p a r t i e s m a y b e s u b j e c t t o a d d i t i o n ar e s t r i c t i o n s .

R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e v oe x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .

T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a rs u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t ya c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r os p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c tt h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t

F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m P r o d u c t s A p p l i c a t i o n s A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e D L P P r o d u c t s w w w . d l p . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d D S P d s p . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r oC l o c k s a n d T i m e r s w w w . t i . c o m / c l o c k s M e d i c a l w w w . t i . c o m / m e d i c a l I n t e r f a c e i n t e r f a c e . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y L o g i c l o g i c . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w oP o w e r M g m t p o w e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m T e l e p h o n y w w w . t i . c o m / t e l e p h o n y R F I D w w w . t i - r f i d . c o m V i d e o & I m a g i n g w w w . t i . c o m / v i d e o R F / I F a n d Z i g B e e S o l u t i o n s w w w . t i . c o m / l p r f W i r e l e s s w w w . t i . c o m / w i r e l e s s

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