Low Power MCU - SASE · [email protected] ... Vida de la batería vs. Ciclo de actividad 7....
Transcript of Low Power MCU - SASE · [email protected] ... Vida de la batería vs. Ciclo de actividad 7....
MSP430 New Technologies and Solutions
2
RadioFrequency (RF)
Energy Harvesting
NativeSub 1V
CapacitiveTouch Sense
FerroelectricRAM (FRAM)
ApplicationSpecificDevices(Electricity or Water Meters, Glucose Monitors)
Sub $1Devices
FutureNow
¿Cómo trabaja un sistema en Ultra Low Power?
5
• Minimize active time• Maximize time in Low Power Modes• Interrupt driven performance on-demand with <1�s wakeup time• Always-On, Zero-Power Brownout Reset (BOR)
Active
Low Power
Average
¿Cómo trabaja un sistema en Ultra Low Power?
6
= LPM3 + RTC_Function
0.60µA + 130µA * 100µs1000000µs
0.60µA + 0.013µA = 0.613µA
Time
1mA
1µA
100µA
10µA
// Partial RTC_Function incrementseconds();incrementminutes();incrementhours();
//
// Partial RTC_Function incrementseconds();incrementminutes();incrementhours();
//
Puntos Clave
Performance de la CPU
Modos de bajos consumo
Sistema de Clock
Consumo y posibilidades de los periféricos
Sistemas de seguridad del chip
Consumo de corriente de la memoria
Ultra-Low Power Is In Our DNA
9
– MSP430 designed for ULP from ground up
– Peripherals optimized to reduce power and minimize CPU usage
– Intelligent, low power peripherals can operate independently of CPU and let the system stay in a lower power mode longerwww.ti.com/ulp
�Multiple operating modes– 100 nA power down (RAM retained)– 0.6 µA standby– 60 µA / MIPS from RAM – 100 µA / MIPS from Flash
�Instant-on stable high-speed clock
�1.8 - 3.6V single-supply operation
�Zero-power, always-on BOR
�<50nA pin leakage
�CPU that minimizes cycles per task
�Low-power intelligent peripherals– ADC that automatically transfers data– Timers that consume negligible power– 100 nA analog comparators
�Performance over required operating conditions
MSP430 Orthogonal CPU
10
• C-compiler friendly
• Memory address increased up to 1MB
• CPU registers increased to 20-bits
• Address word instructions
• Direct 20-bit CPU register access
• Atomic (memory to memory) Instructions
• Cycle count optimization
• Extension word allows all instructions
• Direct access to 1MB address space
• Bit, byte, word and address-word data
• Repeat instruction function
Modos de funcionamiento y bajo consumo– Active Mode – 100 �A/MHz!
– CPU active – Fast Peripherals Enabled– 32 kHz Peripherals Enabled - RTC
– LPM0 – 40 �A– CPU disabled, Fast Peripherals Enabled – Fast Wake up – HF clock sources available
– LPM3 – 0.6 �A– CPU disabled, Fast Peripherals Disabled– 32 kHz Peripherals Enabled (RTC, Wd & SVS)
– LPM4 – 0.5 �A– All clocks disabled – Wake on interrupt from port
– LPM3.5 – 0.4 �A– Regulator & all system clocks disabled except
for RTC (32768Hz LFXT) – Complete FRAM retention– BOR on nRST/NMI or Port I/O or RTC
– LPM4.5 – 0.1 �A– With SVS enabled – With SVS disabled – 10nA
11
���
����
�������
�� ����
�������������
��������
�����
��� �
���
�
��������
��� ����
���
���������
���!����
����"���
��������
!��#��"���
��������
!$$�
� ���"�
�����
�� ����
����
����
����
����
����
����
����%&�!!'(
���$��)
!�*��������
*�+�
Clock System
12
Five independent clock sources Low Freq
– LFXT1 32768 Hz crystal – Special low power option
– VLO 10 kHz – LFMODCLK MODCLK/128
High Freq– XT1, 4 – 24 MHz crystal – XT2, 4 – 24 MHz crystal– DCO Specific CAL range– MODCLK Internal 5MHz
•Default DCO = 1MHz •ACLK = Only LF sources•MODOSC provided to ADC12
Review of available clocks
13
Clock Frequency (nominal)
Precision Current Draw Crystal Required
High-Frequency
DCO 100kHz –32MHz
Low 60uA
HFXT1/2 4 - 32MHz High 60uA @ 12MHz X
MODOSC 5MHz n/a n/a
Low-Frequency
LFXT1 32kHz High 300nA X
VLO 12kHz Low 0nA*
* Included in ILPM3, VLO spec (~1.2uA)
Periféricos Inteligentes ADC12B
14
8, 10 o 12 bitsUp to 200KspsSNR>64dB; ENOB 11 bitsSample & hold programableWindow comparatorDifferential or single-endedUp to 32 channelsAuto power downUltra low current consumption
SE 63uA @ 1,8V 200KspsDiff. 95uA @ 1,8V 200Ksps
Temperature sensor
MSP430 with FRAM – Future of MCU Memory
18
– FRAM is Universal Memory– Superior Endurance
– Proven data retention to 10 years @ 85°C– Over 100 Trillion write/read cycles– Write Guarantee in case of power loss
– Fast write times (like SRAM)– ~50ns per byte – 1,000x faster than Flash/EEPROM
– Non-Volatile, Reliable– Low Power
– Only 1.5v to write & erase – >10-14v for Flash/EEPROM
– Secure– Fast access times– No charge pump– No perceptible difference in read/write processes
– Radiation Resistance - Terrestrial Soft Error Rate (SER) is below detection limits
– Immune to Magnetic Fields - FRAM does not contain iron
FRAM Applications:– Battery Backed SRAM
Replacement – Digital rights management – Data logging, remote sensing– Low Power Electronics– Energy harvesting
FRAM is Programmed by flip of a Ferro Electric Dipole.
www.ti.com/framTI’s FRAM technology
Photo: Ramtron Corp
Memoria Flash en diferentes marcas
19
Flash Kinetis MC9S08QE PIC24HJ128 PIC24FJ2455 ATtiny24A MSP430
Write Time 20uS a 50uS 20 a 50uS 56uS 2mS 4,5mS 36 a 70uS
Sector Erase 20mS 20mS 26mS 26ms 9mS 10mS
Erase All 160mS 100mS 40mS 22ms a 32mS
Idd_PGM 10mA Max 4mA 10mA 10mA 18mA 1mA
Cycling endurance 10K min 10Kmin 10K min 10K min
10K min –(80K EEPROM) 10K min
Access Time 40nS 40nS ? Max 12Mhz 40nS? 40nS
Operating Voltage 1,7V a 3,6V 1,8v a 3,6V 1,8V a 5,5V 2V a 5,5V 2 a 5V 12V 1,8 a 3,6V
RAM retention 1,2V 0,6 - 1V 1,6V
Idd Run Flash @ 3V 420uA/Mhz 640mA/Mhz 1,8mA 480uA 800uA/Mhz 230uA/Mhz
All-in-one: FRAM MCU delivers max benefitsFRAM SRAM EEPROM Flash
Non-volatile Retains data without power
Write speeds
Average active Power [µA/MHz]
Write endurance
DynamicBit-wise programmable
Unified memoryFlexible code and data partitioning
Yes Yes YesNo
100ns 6ms<100ns 85uS
<60110 230
10,000100,000Unlimited100
Trillion+
YesYes NoNo
Yes NoNoNo
Data is representative of embedded memory performance within device
Unified memory: Another dimension of freedom for software developers
One device supporting multiple options “slide the bar as needed”
Multiple device variants may be required
• Easier, simpler inventory management
• Lower cost of issuance / ownership
• Faster time to market for memory modifications
Before FRAM With FRAM
To get more SRAM you may have to buy 5x the needed FLASH ROM
1kB EEPROM
Often an additional
chipis needed
14kB Flash2kB
SRAM
16kB Flash (Program)
2kB SRAM
24kB Flash5kB
SRAM
16kB Universal FRAM
Data vs. program memorypartitioned as needed
• Use Case Example: MSP430F2274 Vs MSP430FR5739
• Both devices use System clock = 8MHz
• Maximum Speed FRAM = 1.5MBps [100x faster]
• Maximum Speed Flash = 12kBps
FRAM = Ultra-fast Writes
• Use Case Example: MSP430F2274 Vs MSP430FR5739
• Both devices write to NV memory @ 12kBps
• FRAM remains in standby for 99% of the time
• Power savings: >200x of flash
FRAM = Low active write duty cycle
• Use Case Example: MSP430F2274 Vs MSP430FR5739
• Average power FRAM = 720µA @ 1.5Mbps
• Average power Flash = 2200µA @ 12kBps
• 100 times faster in half the power
• Enables more unique energy sources
• FRAM = Non-blocking writes
• CPU is not held
• Interrupts allowed
FRAM = Ultra-low Power
• Use Case Example: EEPROM Vs MSP430FR5739
• Many systems require a backup procedure on power fail
• FRAM IP has built-in circuitry to complete the current 4 word write• Supported by internal FRAM LDO & cap
• In-system backup is an order of magnitude faster with FRAM
+ Source: EE Times Europe, An Engineer’s Guide to FRAM by Duncan Bennett
Write comparison during power fail events+
FRAM = Increased flexibility
• Use Case Example: MSP430F2274 Vs MSP430FR5739
• FRAM Endurance >= 100 Trillion [10^14]
• Flash Endurance < 100,000 [10^5]
• Comparison: write to a 512 byte memory block @ a speed of 12kBps
• Flash = 6 minutes
• FRAM = 100+ years!
FRAM = High Endurance
Ultra-low-power data logging
27
Write Endurance
Trillions
10,000 cycles
> 100,000,000,000,000 cycles
Supports more than 150,000 years of continuous data logging (vs. less than 7 minutes with Flash)
– Data logging, remote sensor applications (High Write endurance, Fast writes)
– Digital rights management (High Write Endurance – need >10M write cycles)
– Battery powered consumer/mobile Electronics (low power)
– Energy harvesting, especially Wireless (Low Power & Fast Memory Access, especially Writes)
– Battery Backed SRAM Replacement (Non- Volatility, High Write Endurance, Low power, Fast Writes)
Target Applications
Value Line – Portfolio & Roadmap
29TI Confidential – Maximum Restrictions
���
���
���
���
�����
� � ������
�������
�����
� ��
�������
�����
� � ������
�������
����
������ ��
� ���
!����
� ��
�������
MSP430G2001*
MSP430G21X1*
MSP430G22X1*
ADC
SC
Available now In Development
MSP430G21X2
UART
�����
� � �
�������
MSP430G22X2
MSP430G23X2
MSP430G24X2
MSP430G21X3
MSP430G22X3
MSP430G23X3
MSP430G24X3
MSP430G25X3
SC ADC
SC ADC UART
* 8-pin SOIC package under evaluation
SC ADC
SC ADC
SC ADC
SC ADC
SC ADC
SC ADC UART
SC ADC UART
SC ADC UART
SC ADC UART
Meet the new MSP430 LaunchPad
30
����������� ���������� ����� ��������������
�� ��������� ������"�#$��% �& ��'�(��
�
���������������� ��!�� #��)*+������, ��!��-��#��.��$�/"��
�
��� �����"�# ��$���������, ��!����!��0 �, ��!������
�
��� ��� �����
�������
%&�����'�( ����)�� �����*��� ��')$��')% �)��*� +#$)�-�* �������������������������������
�12�3% (�$$�$�4 )*5(�"�
�
+�,$������������������� ���
��������������
MSP430 with RF – CC430
31
eZ430-ChronosDevelopment tool• Based on CC430, MSP430 w/
integrated <1GHz RF• Integrated 3-axis
accelerometer, altimeter, & temperature sensor
• Includes USB RF access point• Low cost ($49)
CC430
MSP430MCU
Application and protocol
processor
Lowest Power MonolithicRF SoC
Low Power RF
Radio frequency
The Best of Both Worlds
• High sensitivity• Low current consumption• Excellent blocking
performance• Flexible data rate &
modulation format• Backwards compatible
• Market’s lowest power MCU• High analog performance• High level of integration• Ease of development• Sensor interface
MSP430 MCULow Power RF Transceiver
Small Package:
9.1mm x 9.1mm
Wireless Made Easy• Free RF libraries and stacks
• SimpliciTI (Star Network protocol) -www.ti.com/simpliciti
• TIMAC – IEEE 802.15.4 Medium Access Control (MAC)
• Z-Stack – Free ZigBee Stack. Compliant with 2006 ZigBee™ spec (www.ti.com/zigbee)
• Third party partners with mesh network stacks – coming soon!
• SmartRF® Studio - Automatically generates register values
MSP430 : It´s Easy to Get Started
32
• Embedded Emulation enables powerful, low cost development tools
• Real-time, in-system debug – No application resources– Full speed execution – H/W– Single stepping– Complex triggering– Trace capability
• Powerful, easy to use tools
Development Software• Free IDEs available• CCS4 $495 for MCU Edition
eZ430 Development Tools• Complete development Tool• USB Stick form factor• Real-time, in-system debug • Removable target board• Available for wireless development• Starting at $20
Solar Energy Harvesting Kit• Based on eZ430-RF2500• Works in low ambient light; 400+
transmissions in dark• Adaptable to any sensor or RF network
• $149 for complete toolMSP430 Flash Emulation
Tool• 1 programming tool for all devices• $99 for USB FET• $49 target boards available for all
devices
MSP430 Experimenter Boards
• Fully features prototyping system• Available for FG4618 & F5438• Starting at $99