Company Presentation

38
Company Presentation August 2016

Transcript of Company Presentation

Page 1: Company Presentation

Company PresentationAugust 2016

Page 2: Company Presentation

2Copyright © Infineon Technologies AG 2016. All rights reserved.

Table of contents

About Infineon

Market and business development

Customers, products and technology

General company information

1

2

3

4

2016-08-02

Page 3: Company Presentation

3Copyright © Infineon Technologies AG 2016. All rights reserved.

Infineon at a glance

Financials Market Position*

Business Segments Employees

FY 12 FY 13 FY 14 FY 15527 377 620 897

[EUR m]

Europe14,533 employees

About 35,400 employees worldwide(as of Sep. 2015)

Americas3,682 employees

Asia/Pacific17,209 employees

34 R&D locations19 manufacturing locations

Revenue Segment Result Margin

15.5%14.4%9.8%13.5%

3904 3843 43205795

41%

11%

17%

31%

Automotive (ATV)

Industrial Power Control (IPC)

Chip Card & Security (CCS)

Power Management & Multimarket (PMM)

Revenue FY 2015

# 2 # 1

Automotive Power Smart card ICs

# 2Strategy Analytics,

April 2016IHS Markit,July 2016

IHS Markit,July 2016

2016-08-02

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4Copyright © Infineon Technologies AG 2016. All rights reserved.

Part of your life. Part of tomorrow.

We make life easier, safer and greener – with technology that achieves more, consumes

less and is accessible to every one. Microelectronics

from Infineon is the key to a better future.

2016-08-02

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5Copyright © Infineon Technologies AG 2016. All rights reserved.

Infineon enables eco-friendly, connected and safe mobility

ApplicationsEfficient powertrain for combustion, electric and hybrid vehicles, charger station for electric vehicles, car safety, driver assistance systems, chassis and comfort electronics, authentication, mobile security, traction

Courtesy: AUDI

2016-08-02

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Infineon enables efficient generation, transmission and conversion of electrical energy

ApplicationsEnergy transmission and conversion, renewable energy generation, home appliances, power tools, power management (adapters, chargers, power supplies), LED lighting systems, mobile devices, industrial drives, industrial vehicles

Courtesy: AUDI

2016-08-02

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7Copyright © Infineon Technologies AG 2016. All rights reserved.

Infineon enables security in the connected world

ApplicationsInternet of Things, Industry 4.0, mobile security, embedded security, trusted computing, machine to machine, (mobile) payment, SIM applications, transport ticketing, government identification

Courtesy: AUDI

2016-08-02

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8Copyright © Infineon Technologies AG 2016. All rights reserved.

Vishay

STMicro

Fairchild

Mitsubishi

Infineon(incl. IRF)

5.0%

5.7%

6.1%

6.2%

18.6%

Top positions in all major product categories

Discrete power semiconductors and power modulesSource: IHS Markit, July 2016

Microcontroller-based smartcard ICsSource: IHS Markit, July 2016

Automotive semiconductors incl. semiconductor sensorsSource: Strategy Analytics,

April 2016

Automotive semiconductorstotal market in CY 2015:$27.4bn

Powersemiconductorstotal market in CY 2015:$14.8bn

Smart card ICs

total market in CY 2015:$2.72bn

TexasIn-

stru-ments

STMicro

Renesas

Infineon

NXP

7.0%

7.7%

10.3%

10.4%

14.2%

others

STMicro

Samsung

Infineon

NXP

13.3%

15.1%

16.2%

24.8%

30.5%

2016-08-02

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9Copyright © Infineon Technologies AG 2016. All rights reserved.

Leadership in system understanding will foster future growth and profitability

#1, system and technology leader

system leader in automotive

Leader insecurity solutions

Competitive advantages Average-cycle financial targets

broadest technology portfolio;#1 in SiGe; become #1 in base stations by 2020

2016-08-02

Auto

Powe

rRF

Secu

rity

Revenue Growth:~8%

Segment Result Margin:~15%

Investment-to-Sales:~13%

Page 10: Company Presentation

10Copyright © Infineon Technologies AG 2016. All rights reserved.

Table of contents

About Infineon

Market and business development

Customers, segments, products and technology

General company information

1

2

3

4

2016-08-02

Page 11: Company Presentation

11Copyright © Infineon Technologies AG 2016. All rights reserved.

The outlook for the global semiconductor market is cautious

Source: WSTS for historical data. Forecast: of WSTS, IHS Markit, Gartner, IC Insights; last update 25 July 2016

Global semiconductor marketin billion $

Forecast revenue rangeMarket size (revenue)

2016-08-02

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12Copyright © Infineon Technologies AG 2016. All rights reserved.

Financial Year 2015:Revenue Split by Segment

FY 2015 Revenue: € 5,795m*

* Including International Rectifier from 13 January 2015 to 30 September 2015** Other Operating Segments; Corporate & Eliminations

Chip Card& Security

Automotive

PowerManagement & Multimarket

Industrial Power Control

€ 2,351m

€ 666m

OOS+C&E**

€ 13m

€ 971m

€ 1,794m

41% 17%

31%11%

2016-08-02

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13Copyright © Infineon Technologies AG 2016. All rights reserved.

Q3 FY 2016Revenue and Segment Result Growth

[EUR m]

Q3 FY15 Q4 FY15 Q1 FY16 Q2 FY16 Q3 FY16

1,586 1,598 1,556 1,556 1,xxx

245 286 220 228 254

Revenue Segment Result Segment Result Margin

16%18% 14% 14%

+3%

239 1,632

15%

1,611

2016-08-02

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Q3 FY 2016: Revenue, result and margin per segment

* The business with XMC industrial microcontrollers developed by ATV and CCS was transferred to PMM and IPC with effect from 1 October 2015. Previous year’s figures have been adjusted accordingly

ATV* IPC* CCS*PMM*

621 613 614670 676

269 271 249 265 280

517 535 510 496 509

172 181 173 180 172

79 102 81 94 104 30 39 23 26 42 98 110 79 74 79 35 38 35 36 32

Revenue Segment Result Segment Result Margin

+4%

[EUR m]

-2%

15%13% 17% 13% 14%9% 10%14%11% 15%

20% 19%

15%

[EUR m] [EUR m] [EUR m]

0%

20%

16% 16%19% 21%

21% 20%

+9%

2016-08-02

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Infineon GroupResults for FY 2014* and FY 2015**

Segment Result (SR) 620 897

[€ Million] 2014 2015

Net Income 535 634

SR Margin 14.4% 15.5%

Investments 668 785

Free Cash Flow 317 -1.654

Market capitalization*** ~9,240 ~11,355

Net Cash 2,232 220

Revenues Net Income Revenues 4,320 5,795

*** share price as of September 30th, 2014: 8.193 Euro; share price as of September 30th, 2015: 10.055 Euro

FY14 FY15 FY14 FY15

634

4,320

535

5,795+34%

* excl. International Rectifier** Including International Rectifier from 13 January 2015 to 30 September 20152016-08-02

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Infineon GroupResults for Q2 FY16 and Q3 FY16

Segment Result (SR) 228 254

Net Income 180 186

SR Margin 14.2% 15.6%

Gross Cash Position 1,803 2,083

Free Cash Flow 45 277

Net Cash Position 27 299

Revenues 1,611 1,632

186

1,611

180

Q2 FY16 Q3 FY16

1,632+1%

Revenues Net Income

[€ Million] Q2 16 Q3 16

2016-08-02

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Infineon GroupResults for Q3 FY15 and Q3 FY16

Segment Result (SR) 245 254

Net Income 109 186

SR Margin 15.4% 15.6%

Gross Cash Position 1,842 2,083

Free Cash Flow 220 277

Net Cash Position 49 299

Revenues 1,586 1,632+3%

Revenues Net Income

186

1,586

109

Q3 FY15 Q3 FY16

1,632

[€ Million] Q3 15 Q3 16

2016-08-02

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Revenue split by regionsFY 2014* and FY 2015

Americas

11% 12%

Europe, Middle East,Africa (EMEA)

39% 35%

Asia / Pacific

43% 46%

Japan

7% 7%20% 16%therein:

Germany

20% 23%therein: China

FY 2014 FY 2015 *excl. International Rectifier

therein: USA 8% 10%

2016-08-02

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19Copyright © Infineon Technologies AG 2016. All rights reserved.

Table of contents

About Infineon

Market and business development

Customers, Products and Technology

General company information

1

2

3

4

2016-08-02

Page 20: Company Presentation

20Copyright © Infineon Technologies AG 2016. All rights reserved.

Tight customer relationships are based on system know-how and app understanding

EMS partners Distribution partners

ATV IPC CCSPMM

2016-08-02

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21Copyright © Infineon Technologies AG 2016. All rights reserved.

Market-oriented business structure

Cust

omer

s

ApplicationsSegments

IndustrialPowerControl

CO2 reduction;Comfort electronics;Driver assistance systems;Security

Charger station for electric vehicles; Energy transmission and conversion; Home appliances; Industrial drives; Industrial vehicles; Renewable energy generation; Traction; Uninterruptable power supplies

Authentication; Automotive; Governmental identification documents; Healthcare cards; Internet of Things; Mobile communications; Payment systems incl. mobile payment; Secure NFC (Near Field Communication) transactions; Ticketing, access control; Trusted computing

Cellular network infrastructure; DC motors; HiRel (high-reliability components); LED and conventional lighting systems; Mobile devices; Power management (adapters, chargers, power supplies)

Chip Card & Security

Automotive

Power Management& Multimarket

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Product range

Industrial Power Control (IPC)› Bare die business› Discrete IGBTs› Driver ICs› IGBT modules (high-

power, medium-power, low-power)

› IGBT module solutions incl. IGBT stacks

Power Management & Multimarket (PMM)› Control ICs› Customized chips (ASICs)› Discrete low-voltage and

high-voltage power transistors

› GPS low-noise amplifier› Industrial microcontrollers› Low-voltage and high-

voltage driver ICs› MEMS and ASICs for

silicon microphones› RF antenna switches› RF power transistors› TVS (transient voltage

suppressor) diode

Chip Card & Security(CCS)› Contact-based security

controllers› Contactless security

controllers› Dual-interface security

controllers (contact-based and contactless)

Automotive(ATV)› 32-bit automotive

microcontrollers for powertrain, safety and driver assistance systems

› Discrete power semiconductors

› IGBT modules› Magnetic and pressure

sensors› Power ICs› Radar› Transceiver (CAN, LIN,

Flex RayTM* )› Voltage regulators

*FlexRay is a trademark licensed by FlexRay Consortium GbR2016-08-02

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23Copyright © Infineon Technologies AG 2016. All rights reserved.

Semiconductor technology portfolioTechnology portfolio fits needs of logic and power applications

Digital CMOS: 800nm – 65nmTechnology Nodes (Platform <180nm incl. RF, AMS)Analog/Mixed Signal: 500nm – 180nm Technology Nodes (CxNA) eNVM: EEPROM: IMEMR, C9FL, OTP: C5OP (Automotive)eFlash/EEPROM: 250nm – 65nm CxFL (Chip Card), CxFLA, CxFLN (Automotive)HV-CMOS: 130nm, C11HV/HN

Analog Bipolar: DOPL, Ax, BIPEP, B4CD, HED Analog BiCMOS: B6CA, B6CA-CT, B7CA, SPT170 HV-CMOS-SOI, Levelshift(SOI,JI)Smart Power: 1200-130nm BIP/CMOS/DMOS SPTx (Automotive, EDP) (BCD) Smart: CMOS/DMOS, SMARTx, MSMARTx,

SSMARTx, Opto-TRIAC, SPS

Magnetic: BxCAS, C9FLRN_GMROpto: OP-DI, OP-TR, OP-C9N, µ-modules

C11TOF

DMOS: 12-500V Planar and Trench MOSFET (OptiMOS™, StrongIRFET™)

HV-DMOS: Superjunction MOSFET

(CoolMOS™) IGBT: Planar & Trench 500-6500V,

rev. cond., fast recov. diodesSiC/GaN: Diode, JFET / power switches

Pressure: BxCSP, TIREPx

Silicon-Microphones: DSOUND

adopted for automotive, industrial and for high reliability requirements

Power/Analogincl. Green Robust

MEMS/Sensors

CMOS

RF/Bipolar

RF BiCMOS: 25GHz – 100GHz: B6HFC, B9COPT, B10CBipolar IC: 2GHz...200GHz RF-Bipolar: BxHF SiGe: B7HFM, B7/B9HF_SLC, B7HF200,HiPAC: Al/Cu Integrated Passives B11HFC P7Mxx, P7Dxx, P8Mxx RF Switches: C7NP, C11NP Bipolar/Discretes/MMIC: RF-Transistoren NF-TR; BxHF(D/M) SiGe: B7HFD/M, B7HF_SDLeistungsverst.: LDMOS, LDxM, LDxIC, LD9AB RFMOS: HFMDioden: NF-DI, Tuner: DxT, Schottky: DxS PIN: DxP

2016-08-02

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Package technology portfolio

1) for specialities only 2) phase-out

Through Hole› TO, DIPSMD› TO› DSO› SSOP› SupIR› HBxLeadless› ThinPAK› TDSON› TSDSON› DirectFETTM

› TISON› WISON› IQFN› HSOF› Blade

PowerModules

High Power› Easy› 34mm› 62mm› Econo› Econo-PACK™+› Prime-PACK™› IHM› IHV› Hybrid-PACK™ › MDIP› T-PAK› STACK

Intelligent Power Modules› IRAM› CIPOS™› µIPM™

SMD leaded› SOT› SOD› TSOP› TSSOPFlat lead› TSFP› SC

Leadless› TSLP› TSSLP› TSNP

Wafer level› WLP› WLL

DiscretesPower

Sensors

Through Hole› PSSOSMD Leaded› DSOSP› SSOM› TDSO› TISON

Open cavity› DSOF

Mold on LF› P-MCCxMold› P-Mx.xChip on Flex› P-FTMUV Globe top

› T-Mx.xPRELAM› E-PPxx

Flip Chip› S-MFCx.x› S-COMx.x

Wafer› Bumped› Diced

Chip CardLeadframe

based Packages

Wafer Level Packages, Bare Die

Through Hole› DIP 2)

SMD› PLCC 2)

› TSSOP› TQFP› LQFP › MQFPLeadless› VQFN› WQFN› PQFN› O-LQFN 1)

› XSON› USON

PowerICLaminate

based Packages

SMD › OCCN 1,2)

› BGA› LBGA› LGA› xFBGA, xFSGA

Surface Mount Technology(SMD)

Wafer Levelw/o redistribution› WLP (fan-in)

w/redistribution› WLB (fan-in)› eWLB (fan-out)

Bare Die› Wirebond› Flip chip

2016-08-02

Page 25: Company Presentation

25Copyright © Infineon Technologies AG 2016. All rights reserved.

Table of contents

About Infineon

Market and business development

Customers, segments, products and technology

General company information

1

2

3

4

2016-08-02

Page 26: Company Presentation

26Copyright © Infineon Technologies AG 2016. All rights reserved.

Infineon Functional Chart – global view Effective July 01, 2016This chart does not represent the legally binding structure

Corp

orat

e Fu

ncti

ons Communications

K. WaltherCompliance OfficeM. Reisinger

Distribution, EMS & Mass Market GroupP.-Y. FerrardDesign Enabling & Services H. Hiller

Accounting, Controlling & TaxesR. MarkgrafAudit S. KirschBusiness Continuity W.-R. MoritzBusiness ExcellenceS. Jehmlich

Finance & Treasury A. FoltinHuman ResourcesT. MarquardtInformation TechnologyR. LeindlInvestor RelationsJ. Rebel

Legal & PatentM. v. EickstedtSales & Marketing ExcellenceA. KrappelStrategy, Mergers & AcquisitionsA. Schumacher

Ope

rati

ons Frontend

P. Haidas BackendS. H. Tan

Automotive

P. SchieferA. Müller**M. Seitz*

Industrial Power Control P. WawerJ. Lohse

M. Friedinger*

Chip Card & Security

S. HofschenS. Trautwein*

Power Management & Multimarket

A. UrschitzU. Pelzer*

JapanY. Mori, H. Dairaku

Asia PacificA. Chong, H.-M. Stech

AmericasR. LeFort, A. Prillwitz

Regi

ons

This chart does not represent the legally binding structure R. Ploss (CEO)

D. Asam (CFO) J. Hanebeck H. Gassel (CMO)

*reporting to D. Asam ** reporting to H. Gassel

Boar

d

Operations AmericasJ. McKinney

Corporate Supply ChainK. GruberFinanceP. Gruber*Operations ExcellenceP. Stamminger

PurchasingH.-M. SchweizerQuality ManagementA. Heitzer

2016-08-02

Page 27: Company Presentation

27Copyright © Infineon Technologies AG 2016. All rights reserved.

35,424 Employees Worldwide (as of September 30, 2015)

9,426

174

Mexico

Americas3,682 employees

USA

2,142

297

Asia/Pacific17,209 employees

2,229

9,8471,986

Europe14,533 employees

5323,457

15259

2,1361,546

212 325140

26RomaniaSweden

Germany

Great BritainAustria

PortugalFranceItaly Japan

Singapore

IndiaMalaysiaChina

Korea

Indonesia

163498 Hungary

Taiwan39

19 DenmarkPhilippines

12 Other Europe7 Australia

2016-08-02

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28Copyright © Infineon Technologies AG 2016. All rights reserved.

Decisive competitive advantage: Quality

Our standards› International Standards, e.g. TS16949,

ISO 9001, IEC 17025› Specific customer requirements

Our aspiration› Preferred partner for our customers› Smooth production and delivery› We focus on stability and the

100 percent fulfillment of our commitments

Our path› Integrated approach along the entire

value chain› Proactive Quality Management for

products and processes

2016-08-02

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29Copyright © Infineon Technologies AG 2016. All rights reserved.

Our global R&D network

Malacca

Ipoh

Beijing

Morgan Hill

Seoul

Shanghai

BangaloreTorrance

WarsteinDuisburg

Bristol

Augsburg

Neubiberg

Padua

Villach

Graz

Regensburg

Dresden

Bukarest

Linz

Warwick

Tewksbury

Irvine

Le Puy Sainte Réparade

Pavia

Skovlunde

El Segundo

San José

Leominster

ChandlerSingapore

Reigate

Manila

Mesa

2016-08-02

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30Copyright © Infineon Technologies AG 2016. All rights reserved.

Worldwide manufacturing sites frontend and backend

Dresden Beijing

Wuxi

BatamWarstein Cegléd Malacca

KulimLeominsterSan JoseMorgan Hill

Mesa

Tijuana

Temecula

Singapore

Newport

Cheonan

Regensburg Villach

Frontend Backend

2016-08-02

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31Copyright © Infineon Technologies AG 2016. All rights reserved.

Our global sales network

São Paulo

Kokomo

Livonia

Bangalore

Seoul

Singapore

Libanon Beijing

Milpitas

Melbourne,Blackburn

Osaka

Shenzhen

Taipei

Tokyo

Nagoya

Hong Kong

Shanghai

Rotterdam

MilanMarseille

Stuttgart

Paris

Warstein

Madrid

Dublin

Bristol

Stockholm

Espoo

Moscow

Vienna

Erlangen

Zurich

Munich

Hanover

Frankfurt

Xi'an

El Segundo

Reigate

IstanbulBarcelona

Duisburg

Leominster

Hayward

Durham

Raleigh

2016-08-02

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32Copyright © Infineon Technologies AG 2016. All rights reserved.

Corporate Social Responsibility (CSR)› CSR comprises our voluntary commitment in: Human Resources

Management and Human Rights, Environmental Sustainability, Occupational Safety and Health, Corporate Citizenship*, CSR Supply Chain Management as well as Business Ethics.

› Infineon entered the UN Global Compact as one of the first semiconductor companies already in 2004 and is voluntary committed to the 10 Principles.

› Infineon is for the 6th time listed in the Sustainability Yearbook. › Infineon is continuously listed in the Dow Jones Sustainability

Index since 2010 and for the first time in the Dow Jones Sustainability World Index in 2015 and thus is among the top 10% of the most sustainable companies in the world.

› Infineon does not compromise in human rights and business ethics.

› Infineon's products and solutions as well as our efficient resources management enable a significant net ecological benefit.

*social engagement of companies. 2016-08-02

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33Copyright © Infineon Technologies AG 2016. All rights reserved.

Corporate Social ResponsibilitySuccessful CSR approach

UNGlobal

Compact

since 2004

Infineon IMPRES*)

since 2005

› According to RobecoSAM, Infineon is among the top 10% most sustainable companies worldwide.

› RobecoSAM "Runners-up" Award (2013)

since 2012

Energy Management

System, integrated in

IMPRES*)Dow Jones

Sustainability Index

since 2010

since 2011

Sustainability Yearbook

oekom classification as "Prime"

since 2013STOXX®

Global ESG Leaders Indices

since 2014Dow Jones

Sustainability World Index

since 2015

Continuous Approach

Company FoundationWorldwide certified environmentalmanagement system according toISO 14001

*) Infineon Integrated Management Program for Environment, Energy, Safety and Health

The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.2016-08-02

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34Copyright © Infineon Technologies AG 2016. All rights reserved.

Corporate Social Responsibility We are excellent in resources efficiency

About 21% less water consumed per square centimeter produced wafer than the global average

About 40% less electricity consumed per square centimeter produced wafer than the global average

About 50% less waste generated per square centimeter produced wafer than the global average

At Infineon, less is more

We use resources much more efficient in our production processes than the global average of the semiconductor industry.

Basis for the calculations are the square centimeters processed wafer area in the front-end production and consumptions accordingto WSC definition.

The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.

-40% -21% -50%

2016-08-02

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35Copyright © Infineon Technologies AG 2016. All rights reserved.

Corporate Social ResponsibilityWe create a net ecologic benefit

The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.

Emission Reduction enabled by our products and solutions

Net ecological benefit:CO2 emissions reduction around 35 million tons

1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, water/wastewater, direct emissions, energy consumption, waste, etc. and is based on internally collected data and externally available conversion factors. All data relate to the 2015 fiscal year.2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2014 and considers the following fields of application: automotive, LED, PC power supply, renewable energy (wind, photovoltaic), drives as well as induction cookers. CO₂ savings are calculated on the basis of potential savings of technologies in which semiconductors are used. The CO2 savings are allocated on the basis of Infineon market share, semiconductor content and lifetime of technologies concerned, based on internal and external experts' estimations. Despite the fact that CO₂ footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.

CO2 savings2)

around36.5

million tonsCO2 equivalents

CO2 burden1)

around1.6

million tonsCO2 equivalents

Ratio around 1:23

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36Copyright © Infineon Technologies AG 2016. All rights reserved.

Business Continuity Integrated management

Business ContinuityISO 27001* ISO 50001***

ISO 14001** OHSAS 18001**

Loss & Fraud Investigations

Real Estate& Facility

Management

Business & Operations

Support

Environmental Affairs,

Sustainability & Energy

Management

InformationSecurity &IT Security

Management

Corporate Social

ResponsibilityExport

ComplianceBusiness

Continuity Planning

Security & Crisis

ManagementAsset

Protection

*ISO 27001: in process of certification; ** ISO 14001/OHSAS 18001 worldwide certification scheme; *** ISO 50001 certified at EU sites2016-08-02

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